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 M65667SP
Picture-in-Picture Signal Processing
REJ03F0186-0201 Rev.2.01 Mar 31, 2008
Description
The M65667SP is a NTSC PIP (Picture in Picture) signal processing LSI, whose sub and main-picture inputs are composite and Y/C separated signals, respectively. The built-in field memory (96 Kbit RAM), V-chip data slicer and analog circuitries lead the PIP system low cost and small size.
Features
* * * * * * Built-in 96 Kbit field memory (sub-picture data storage) Internal V-chip data slicer (for sub-picture) Pin compatible with M65617SP Vertical filter for sub-picture (Y signal) Single sub-picture (selectable picture size: 1/9, 1/16) Sub-picture processing specification (1/9 size / 1/16 size) Quantization bits Y, B-Y, R-Y: 6 bits Horizontal sampling 171 pixels (Y), 28.5 pixels (B-Y, R-Y) Vertical lines 69/52 lines * Frame (sub-picture) on/off * Built-in analog circuits Two 8-bit A/D converters (main and sub-picture signals) Two 8-bit D/A converters (Y and C sub-picture signals) Sync-tip-clamp, VCXO, Analog switch, etc. * I2C BUS control (parallel/serial control) PIP on/off, Sub-picture size (1/9 or 1/16), Frame on/off (programmable luma level), PIP position (4 corners fixed position), Picture freeze, Y delay adjustment, Chroma level, Tint, Black level, Contrast, etc.
Application
NTSC color TV
Recommended Operating Condition
Supply voltage range ................................. 3.1 to 3.5 V Operating frequency ................................. 14.32 MHz Operating temperature .............................. -20 to 75C Input voltage (CMOS interface) "H" ............... Vdd 0.7 to Vdd V "L" ............... 0 to Vdd 0.3 V Output current (output buffer) ..................... 4 mA (Max) Output load capacitance ........................... 20 pF (Max) Note2 Circuit current ....................................... 160 mA Notes: 1. Connect a 0.1 F or larger capacitor between Vdd and Vss pins. 2. Include pin capacitance (7 pF)
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 1 of 11
M65667SP
Block Diagram
SCK CSYNC (s) /TEST1 BGP (s) /TEST0
Yin Sync tip clamp Cin Vdd/Vss For test DATA CLK ACK Vin (s) 15 3 3 I2C I/F A/D 8 bit RAM (1H) V-chip data slicer Luma clamp Delay Y 6 Back porch clamp AFC Timing gen (Decode) B-Y Demod Tint R-Y 6 6 Y B-Y R-Y Timing gen (Memory cont) Vert-filter & MUX Bias
Y-PlP Bias C-PlP
C-PlPin
Y Y/C SEP (LPF, BPF)
Sync tip clamp 2 HD (I C)
2
Y-PlPin
Vrt (m) Vrb (m)
Sync sep Phase select HPLL 4 fsc Delay C
SWMG /TEST7
ADJ-Ysub Yout-sub D/A 8 bit D/A 8 bit
Demux
Delay MIX
Delay LPF &MPY
6
Y RAM 96 Kbits
Encode
6 B-Y 6 R-Y
VD /CSYNC /TEST6 HD /TEST5 FILTER
Cout-sub
fsc Level detect
ADJ-Csub Vin (m) Bias A/D 8 bit
Burst data sampling
Phase detect Lock/Free-run via I2C VCXO driver
BIAS 4 fsc VCXO in VCXO VCXO out
Vrt (m) Vrb (m)
2
RESET
MCK
BGP (m) /TEST2
fsc /TEST3
SWM /TEST4
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 2 of 11
M65667SP
Pin Arrangement
M65667SP AVss3 (vcxo) 1 VCXO out 2 VCXO in 3 FILTER 4 BIAS 5 AVdd3 (vcxo) 6 AVdd2 (m) 7 Vin (m) 8 Vrt (m) 9 Vrb (m) 10 AVss2 (m) 11 AVdd1 (s) 12 Vin (s) 13 Vrt (s) 14 Vrb (s) 15 AVss1 (s) 16 RESET 17 DVss1 18 DVdd1 19 BGP (s)/TEST0 20 SCK 21 CSYNC (s)/TEST1 22 ACK 23 DATA 24 CLK 25 DVss2 (ram) 26 (Top view) Outline: PRDP0052BA-A (52P4B)
52 AVssf (ana) 51 Cin 50 TESTEN 49 Yin 48 TEST9 47 Y-PIP 46 TEST8 45 C-PIP 44 AVdd4 (da) 43 C-PIPin 42 AVss4 (da) 41 Y-PIPin 40 ADJ-Ysub 39 Yout-sub 38 ADJ-Csub 37 Cout-sub 36 DVss3 35 DVdd3 34 LOCK/TEST7 33 VD/CSYNC/TEST6 32 HD/TEST5 31 SWM/TEST4 30 MCK 29 fsc/TEST3 28 BGP (m)/TEST2 27 DVdd2 (ram)
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 3 of 11
M65667SP
Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 Name AVss3 (vcxo) VCXO out VCXO in FILTER BIAS AVdd3 (vcxo) AVdd2 (m) Vin (m) Vrt (m) Vrb (m) AVss2 (m) AVdd1 (s) Vin (s) Vrt (s) Vrb (s) AVss1 (s) RESET DVss1 DVdd1 BGP (s) /TEST0 SCK CSYNC (s) /TEST1 ACK DATA CLK DVss2 (ram) DVdd2 (ram) BGP (m) /TEST2 fsc/TEST3 MCK SWM/TEST4 HD/TEST5 VD/CSYNC/TEST6 SWMG/TEST7 DVdd3 DVss3 Cout-sub ADJ-Csub Yout-sub ADJ-Ysub Y-PIPin AVss4 (da) C-PIPin AVdd4 (da) C-PIP I/O GND O I I O Vdd Vdd I O O GND Vdd I O O GND I GND Vdd (I/) O I I (/O) O I I GND Vdd (I/) O I (/O) I (I/) O I (/O) I (/O) I (/O) Vdd GND O I O I I GND I Vdd O Function Connects to analog GND VCXO output signal VCXO input signal Filter Bias Connect to analog power supply Connect to analog power supply Chroma signal input (main-picture) A/D Vref+ (main-picture) A/D Vref- (main-picture) Connect to analog GND Connect to analog power supply Composite video signal input (sub-picture) A/D Vref+ (sub-picture) A/D Vref- (sub-picture) Connect to analog GND Power on reset input signal ("L" reset) Connect to digital GND Connect to digital power supply For test For test (connect to digital GND) For test (connect to digital GND) I2C bus-data/Acknowledge output signal I2C bus-data input signal I2C bus-clock input signal Connect to digital GND Connect to digital power supply For test For test (pull down to digital GND by resistor 15 k) For test (connect to digital GND) For test Horizontal sync input signal (Positive going edge is used) Vertical sync input signal (active "H") Enable input signal to display sub picture ("H" enable) Connect to digital power supply Connect to digital GND D/A output signal (Chroma signal of sub-picture) D/A adjust for chroma signal (sub-picture) D/A output signal (Luma signal of sub-picture) D/A adjust for luma signal (sub-picture) PIP luma signal re-input Connects to analog GND PIP chroma signal re-input Connect to analog power supply PIP chroma signal output Remarks
100 k to Vdd, 10 F to GND
Non connect Connect to GND Pull down 15 k
Non connect Pull down 15 k Connect to GND Non connect
Pull up 15 k
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 4 of 11
M65667SP
Pin Description (cont.)
Pin No. 46 47 48 49 50 51 52 Name TEST8 Y-PIP TEST9 Yin TESTEN Cin AVssf (ana) I/O I O I I I I Vss Function For test (connect to analog GND) PIP luma signal output For test (connect to analog GND) Luma input signal (main-picture) For test (connect to analog GND) Chroma input signal (main-picture) Connect to analog GND Remarks Pull up 15 k Connect to GND Connect to GND
Absolute Maximum Ratings
(Vss = 0 V)
Limits Item Supply voltage (3.3 V) Input voltage Output voltage Output current
Note1
Symbol VDD3 VI VO IO Pd Topr Tstg
Min -0.3 -0.3 -0.3 -- -- -20 -50
Max 4.6 VDD3 + 0.3 VDD3 + 0.3 IOL = 20 IOH = -26 1400 75 125
Unit V V V mA mW C C
Power dissipation Operating temperature Storage temperature Note:
1. Output current per output terminal. But Pd limits all current.
Thermal Derating (Maximum Rating)
2000
Power Dissipation Pd (mW)
1600
1490
1200
800
400
0 0 25 50 75 100 125
Ambient Temperature Ta (C)
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 5 of 11
M65667SP
DC Characteristics
(Ta = 25C, unless otherwise noted, Vss = 0 V)
Item Input voltage (CMOS interface) Input voltage schmitt trigger (CMOS interface) Output voltage Output current Input current Output leakage current Input pin capacitance Output pin capacitance Bidirectional pin capacitance Operating current 3.3 V supply L H - + Hysteresis L H L H L H L H Symbol VIL VIH VT- VT+ VH VOL VOH IOL IOH IIL IIH IOZL IOZH CI CO CIO IDD Min 0 2.52 0.5 1.4 0.3 -- 3.25 4 -- -1 -1 -1 -1 -- -- -- -- Limits Typ -- -- -- -- -- -- -- -- -- -- -- -- -- 7 7 7 -- Max 0.81 3.6 1.65 2.4 1.2 0.05 -- -- -4 1 1 1 1 15 15 15 140 Unit V V V V V V V mA mA A A A A pF pF pF mA Test Conditions VDD = 2.7 V VDD = 3.6 V VDD = 3.3V
VDD = 3.3 V, |IO| < 1 A VDD = 3.0 V, VOL = 0.4 V VDD = 3.0 V, VOH = 2.6 V VDD = 3.6 V, VI = 0 V VDD = 3.6 V, VI = 3.6 V VDD = 3.6 V, VO = 0 V VDD = 3.6 V, VO = 3.6 V f = 1 MHz, VDD = 0 V
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 6 of 11
M65667SP
PIP TV System Block Diagram
(BASIC) Y C C BLPLL B-LD Y C CV PIP signal processing Y C
Composite video signal
Y/C Separation
Y
M65667SP Y C Video signal processing
Deflection unit Yoke
Y/C separated video signal
+
HD
VD
Driving Method and Operating Specification for Serial Interface Data (1) Serial data transmission completion and start A low-to-high transition of the DATA (serial data) line while the CLK (serial clock) is high, that completes the serial transmission and makes the bus free. A high-to-low transition of the DATA line while the CLK is high, that starts the serial transmission and waits for the following CLK and DATA inputs. (2) Serial data transmission The data are transmitted in the most significant bit (MSB) first by one-byte unit on the DATA line successively. One-byte data transmission is completed by 9 clock cycles, the former 8 cycles are for address/data and the latter one is for acknowledge detection. (In reading state, ACK is "H" under these two conditions; 1. The coincidence of two address data for the address data transmission. 2. The completion of 8-bit setting data transfer. In writing state, ACK is "H" with the address coincidence and ACK is "L" for detecting acknowledge input from the master (micro processor) after sending 8-bit setting data). For address/data transmission, DATA must change while CLK is "L". (The data change while CLK is "H" or the simultaneous change of CLK and DATA, that will be a false operation because of undistinguished condition from the completion/start of serial data transfer.) After the beginning of serial data transmission, the total number of data bytes that can be transferred are not limited. (3) The byte format of data transmission (The sequence of data transmission) 1. The byte format during data setting to M65667SP are shown as follows. In right after the forming of serial data transmitting state, the slave address 24h (00100100b) is transferred. Afterwards, the internal register address (1 byte) and setting data (by 1 byte unit) are transferred successively. Several bytes of setting data can be handled in the one transmission. In this operation, the setting data are written into the address resister whose address is increased one in initially transferred internal register address. (The next address of 7Fh, it returns to 00h.) 2. The byte format during data reading from M65667SP are shown as follows. Before data reading from M65667SP, whose internal address need to be set by the data reading/transmitting. After the data reading/transmitting, the operation of "serial data transmission completion and start" (described in (1)) is necessary. Continuously, the slave address 25h (00100101b) is sent, and then the inverted read out data are available on ACK. Several bytes of writing data can be handled in the one transmission, too. In this operation, the setting data also are written into the address register whose address is increased one in initially transferred internal register address. (The next address of 7Fh, it returns to 00h.)
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 7 of 11
M65667SP The Examples of Serial Byte Transmission Format (1) The writing operation of the setting data (AAh) into M65667SP internal address of 00h
Transmission activation Confirmation of bus free (DATA = 'H') No is applied on CLK for the release of output state S: Operation of serial transmission start A: Acknowledge detection D: Dummy clock feed for the release of acknowledge output state E: Operation of serial transmission completion Yes
S
24h
A
00h
A
AAh
ADE
(2) The writing operation of the setting data (FFh, 80h, EEh) into M65667SP internal address of 04h to 06h
Confirmation of bus free (DATA = 'H') No is applied on CLK for the release of output state Yes
Transmission activation
S
24h
A
04h
A
FFh
A
80h
A
EEh
ADE
(3) The reading operation of the setting data from M65667SP internal address of 00h
Confirmation of bus free (DATA = 'H') No A: Bus free operation by the master (micro processor) is applied on CLK for the release of output state Yes
Transmission activation
S
24h
A
00h
ADES
25h
A
$$h
A
(4) The reading operation of the setting data from M65667SP internal address of 04h to 06h
Confirmation of bus free (DATA = 'H') No is applied on CLK for the release of output state A: Output L operation by the master (micro processor) Yes
Transmission activation
S
24h
A
04h
ADES
25h
A
$$h
A
$$h
A
$$h A
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 8 of 11
M65667SP
Timing Diagram
(1) (2) (3) (4) (5) (6) (7) (8) (9) (1)
CLK
DATA
Bit7 (MSB)
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0 (LSB)
ACK Detec.
Bit7 (MSB)
ACK _Acknowledge
ACK _Readout data
Bit7 (MSB)
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0 (LSB)
Bit7 (MSB)
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 9 of 11
M65667SP
Application Example
Horizontal sync input signal (main-picture) Vertical sync input signal (main-picture)
Chroma input signal (main-picture)
Luma signal input (main-picture)
Ana.
68 pF Ana. 10 F 103 F 103 F 103 F Ana.
470
104 F
104 F Ana. 15 k
150 pF
360
+
Dig Dig 10 F
104 F
104 F
+
103 F
Sub-picture displaying on/off
PIP Chroma signal output
PIP Luma signal output
15 k 33 32 31 30 29 28 27 + 103 F 10 F
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
M65667SP
1
2
3
4
5
6 470 k
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
14 pF 51 330 104 F Digital +3.3 V power supply Digital GND Ana. Analog +3.3 V power supply Analog GND
100 k 103 F 2 k 3.3 F
104 F 103 F 103 F 103 F 103 F
+
+
10 F 10 F 103 F Ana. 104 F
100 k Dig 5 V Dig 5 V
10 F 103 F
103 F Ana. Ana.
47 k
12 k
47 k
10 k
10 F Dig
SYNC SEP Circuit (Optional) Composite video input signal (sub-picture)
330 560 100 100 10 k
SDA
SCL
+
100 I2C BUS Clock input signal I2C BUS DATA input/output signal
Note:
Separate Y/C signals by using LC-tank circuit or LPF, BPF for Y/C signals level adjust. And then mix both signals for sub-picture input video signal.
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 10 of 11
12 k
+
+
M65667SP
Package Dimensions
JEITA Package Code P-SDIP52-13x45.85-1.78 RENESAS Code PRDP0052BA-A Previous Code 52P4B MASS[Typ.] 5.1g
52
27
1
26 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
*1
*2
D
Reference Symbol
c
e1
E
Dimension in Millimeters
SEATING PLANE *3 e b3 bp *3 b 2
e1 D E A A1 A2 bp b2 b3 c e L
Min 14.94 45.65 12.85 0.51 0.4 0.65 0.9 0.22 0 1.528 3.0
Nom 15.24 45.85 13.0
Max 15.54 16.05 13.15 5.5
L
A
A1
A2
3.8 0.5 0.6 0.75 1.05 1.0 1.3 0.27 0.34 15 1.778 2.028
REJ03F0186-0201 Rev.2.01 Mar 31, 2008 Page 11 of 11
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. 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